Home
Service items
01.
Chip testing
02.
Precision Ball Placement
03.
Firmware Programming
04.
Lead Trimming
05.
Automated Tape Packaging
06.
Chip packaging
07.
Chip Compatibility
Application
01.
AI Data Center
02.
Consumer electronics
03.
Industry and IOT
Advantage
01.
Service Advantages
02.
Technical Advantages
03.
Solution advantages
News
01.
Enterprise News
02.
Service focus
03.
Industry Insights
About BenteIC
01.
About us
02.
Team Introduction
03.
History
04.
Culture
05.
Honors
06.
Future Plan
Contact us
Join us
Search
中文
Imported IC
Domestic IC
Burning processing
Filter by type
Choose a brand
CHIPWISE(驰芯微) (2)
LCS(凌科芯安) (4)
Nations(国民技术) (2)
TIH Microelectronics(方寸微) (4)
GZSJ(广州盛炬) (1)
IMQ(汉芝) (1)
HSEC(宏思电子) (9)
MODSEMI(模微半导体) (6)
Runjet(瑞纳捷) (8)
SHOUDING(首鼎半导体) (1)
ESMT(晶豪) (3)
Rayson(晶存) (7)
Zentel(力积电子) (4)
CXMT(长鑫) (10)
ETRON(钰创) (1)
Nanya(南亚科技) (28)
Apmemory (1)
Lyontek(来扬) (18)
IBM (39)
Siproin(上海矽朋) (2)
AMD(超微) (9)
HARRIS(哈利斯) (23)
Yeestor(得一微) (4)
KIOXIA(铠侠) (7)
HeYangTek(南京扬贺扬) (21)
Dosilicon(东芯) (5)
Insignis (21)
ICMAX(宏旺) (10)
CS(创世) (9)
MK(米客方德) (77)
华虹挚芯 (7)
WT(唯创知音) (8)
Zbit(恒烁) (11)
XTX(芯天下) (83)
KHIC(港宏) (9)
MXIC(旺宏电子) (163)
Intel/Altera (26)
Greenliant(绿芯) (19)
SANYOU(三友) (1)
SANYO DENKI(山洋) (1)
Rochester Electronics(罗彻斯特) (15)
成都为开 (1)
Giantec(聚辰) (11)
Catalyst Semiconductor Inc. (177)
CW(芯源) (1)
TECH PUBLIC(台舟) (1)
HX(恒佳兴) (2)
I-CORE(中微爱芯) (3)
GXCAS(中科银河芯) (14)
HTCSEMI(海天芯) (4)
GN(旌芯半导体) (1)
LX(灵星芯微) (6)
BL(上海贝岭) (8)
JSMSEMI(杰盛微) (1)
HGC(深圳汉芯) (33)
PUOLOP(迪浦) (1)
FMD(辉芒微) (48)
Zetta(澜智) (117)
HXY MOSFET(华轩阳电子) (10)
XBLW(芯伯乐) (15)
PUYA(普冉) (104)
IDCHIP(英锐芯) (6)
BOYAMICRO(博雅) (42)
Slkor(萨科微) (7)
Phoenix Contact (1)
Toshiba (2)
Kingston (5)
Renesas Electronics (5)
IDT (18)
Winbond (18)
AMIC Technology (18)
Hynix (1)
Greenwich Instruments (4)
Maxim Integrated (2)
ROHM (1)
STMicroelectronics (3)
onsemi (1)
FUJITSU(富士通) (2)
Cypress Semiconductor (11)
Vilsion (1)
HOLTEK(合泰/盛群) (3)
Spansion (8)
Infineon (2)
Alliance Memory (108)
HK(航顺) (2)
HGSEMI(华冠) (65)
FM(复旦微) (41)
TOSHIBA(东芝) (1)
CYPRESS(赛普拉斯) (1160)
ATO SOLUTION (5)
Kingston(金士顿) (31)
FORESEE(江波龙) (55)
Microchip (1)
GigaDevice(兆易创新) (76)
micron(镁光) (1935)
HYNIX(海力士) (34)
Micron (39)
ADI(亚德诺) (5)
Semtech (2)
PANASONIC(松下) (3)
Asahi Kasei Microdevices/AKM (20)
Honeywell(霍尼韦尔) (2)
SHARP/Socle Technology (3)
Sharp Microelectronics (53)
SAMSUNG(三星半导体) (388)
Ramtron (2)
Nexperia(安世) (19)
Seiko Instruments (1)
Nearson Inc. (1)
Amphenol SSI Technologies (1)
DeLorme (1)
Würth Elektronik (1)
Enfis (1)
Vishay Vitramon (1)
Johanson Technology Inc. (1)
Sensata (2)
Luminary Micro Division of Texas Instruments (1)
Johanson Dielectrics Inc. (1)
Vishay Sprague (1)
Ledil (1)
Vishay Sfernice (1)
Parallax Inc. (7)
Bulgin (1)
SparkFun Electronics (2)
Micron Technology Inc. (1)
MoSys, Inc. (26)
SANDISK(闪迪) (38)
Qimonda (3)
Adafruit Industries LLC (2)
NXP(恩智浦) (37)
Kioxia America, Inc. (127)
Intel (13)
TI(德州仪器) (65)
Fremont Micro Devices Ltd (222)
Cypress Semiconductor Corp (294)
Renesas Electronics Operations Services Limited (18)
Silicon Motion, Inc. (447)
GSI Technology Inc. (250)
Etron Technology, Inc. (75)
ABLIC(艾普凌科) (169)
Kaga FEI America, Inc. (155)
ATP Electronics, Inc. (40)
Flexxon Pte Ltd (67)
Delkin Devices, Inc. (2)
Swissbit (63)
Everspin Technologies Inc. (237)
RENESAS(瑞萨)/IDT (7893)
TT Electronics (1608)
Insignis Technology Corporation (329)
Infineon(英飞凌) (8630)
ADI(亚德诺)/MAXIM(美信) (532)
Renesas Design Germany GmbH (25)
ISSI(美国芯成) (5643)
GigaDevice Semiconductor (HK) Limited (273)
ROHM(罗姆) (909)
Macronix (981)
WINBOND(华邦) (2573)
Adesto Technologies (752)
MICROCHIP(美国微芯) (9169)
onsemi(安森美) (1230)
ST(意法半导体) (757)
Model
Brand
Choose a brand
IS46LQ32640A-062TBLA2-TR
ISSI(美国芯成)
200-TFBGA（10x14.5）
IS43LQ32640AL-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ32640AL-062BLI
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ32640A-062BLI
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ32640A-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16256AL-062BLI
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16256AL-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16256A-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16128A-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16128AL-062BLI
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LQ16128A-062BLI
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LD32640C-25BLI-TR
ISSI(美国芯成)
134-TFBGA（10x11.5）
IS43LQ16128AL-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
IS43LD32640C-25BLI
ISSI(美国芯成)
134-TFBGA（10x11.5）
IS43LD16128C-25BLI-TR
ISSI(美国芯成)
134-TFBGA（10x11.5）
IS43LD16128C-25BLI
ISSI(美国芯成)
134-TFBGA（10x11.5）
IS25WQ020-JBLE-TR
ISSI(美国芯成)
8-SOIC
IS25WP128-JMLE-TY
ISSI(美国芯成)
16-SOIC
IS46LQ32640A-062TBLA2
ISSI(美国芯成)
200-TFBGA（10x14.5）
IS43LQ32128AL-062BLI-TR
ISSI(美国芯成)
200-VFBGA（10x14.5）
Home
Previous
Next
End
