Imported IC Domestic IC Burning processing
     
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DS24B33Q+T&R ADI(亚德诺)/MAXIM(美信) 6-TDFN(3x3)
AT25DF321A-MH-T Adesto Technologies 8-UDFN(5x6)
MX25L6445EM2I-10G Macronix 8-SOP
IS25LP128-JBLE ISSI(美国芯成) 8-SOIC
M24M01-DWDW3TP/K ST(意法半导体) 8-TSSOP
23LC1024T-I/SN MICROCHIP(美国微芯) 8-SOIC
SST26VF032B-104I/MF MICROCHIP(美国微芯) 8-WDFN(5x6)
25LC512-I/SM MICROCHIP(美国微芯) 8-SOIJ
25AA512-I/SN MICROCHIP(美国微芯) 8-SOIC
W9825G6KH-6 WINBOND(华邦) 54-TSOP II
SST26VF032BT-104I/MF MICROCHIP(美国微芯) 8-WDFN(5x6)
W25N01GVZEIG TR WINBOND(华邦) 8-WSON(8x6)
M24M01-DWMN3TP/K ST(意法半导体) 8-SOIC
FM24CL64B-GTR Infineon(英飞凌) 8-SOIC
AT45DB161E-MHF-T Adesto Technologies 8-UDFN(5x6)
SST26VF032B-104I/SM MICROCHIP(美国微芯) 8-SOIJ
MR45V064BMAZAATL ROHM(罗姆) 8-SOP
MX25U6435FZNI-10G Macronix 8-WSON(6x5)
DS2431P+ ADI(亚德诺)/MAXIM(美信) 6-TSOC
M95M04-DRMN6TP ST(意法半导体) 8-SOIC