Imported IC Domestic IC Burning processing
     
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M24M02-DRCS6TP/K ST(意法半导体) 8-WLCSP(3.56x2.01)
GD25Q256DYIGR GigaDevice Semiconductor (HK) Limited 8-WSON(6x8)
23LC1024-I/ST MICROCHIP(美国微芯) 8-TSSOP
MX25L12833FMI-10G Macronix 16-SOP
W25N512GVEIG WINBOND(华邦) 8-WSON(8x6)
AT45DB321E-SHF2B-T Adesto Technologies 8-SOIC
23LC1024-I/SN MICROCHIP(美国微芯) 8-SOIC
M95M01-DWDW4TP/K ST(意法半导体) 8-TSSOP
AT45DB321E-SHF-T Adesto Technologies 8-SOIC
MX25L6445EMI-10G Macronix 16-SOP
MX25L12833FM2I-10G Macronix 8-SOP
MX25U12832FM2I02 Macronix 8-SOP
CY62128ELL-45SXIT Infineon(英飞凌) 32-SOIC
IS61C1024AL-12JLI ISSI(美国芯成) 32-SOJ
IS25LP128-JKLE ISSI(美国芯成) 8-WSON(6x5)
25AA512-I/P MICROCHIP(美国微芯) 8-PDIP
IS62C1024AL-35QLI ISSI(美国芯成) 32-SOP
IS62C1024AL-35TLI ISSI(美国芯成) 32-TSOP I
IS61C6416AL-12TLI ISSI(美国芯成) 44-TSOP II
SST26VF032B-104V/SM MICROCHIP(美国微芯) 8-SOIJ