Imported IC Domestic IC Burning processing
     
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K4EBE304EB-EGCG SAMSUNG(三星半导体) FBGA-178
K3UHAHA0AM-AGCL SAMSUNG(三星半导体) FBGA-556
K3QF3F30BM-AGCF SAMSUNG(三星半导体) FBGA-253
K4B2G1646F-BFMA SAMSUNG(三星半导体) FBGA-96
K4B1G0846I-BMMA SAMSUNG(三星半导体) FBGA-78
K4A8G085WC-BIWE SAMSUNG(三星半导体) FBGA-78
K4A4G165WE-BIWE SAMSUNG(三星半导体) FBGA-96
K4A4G085WE-BCTD SAMSUNG(三星半导体) FBGA-78
K4A8G165WB-BIRC SAMSUNG(三星半导体) FBGA-96
H9HCNNNCPMMLXR-NEE HYNIX(海力士) BGA-200
K4UCE3Q4AA-MGCL SAMSUNG(三星半导体) FBGA-200
K4AAG165WA-BITD SAMSUNG(三星半导体) FBGA-96
H5GC8H24AJR-R2C HYNIX(海力士) -
K4FBE3D4HM-TFCL SAMSUNG(三星半导体) FBGA-200
K4Z80325BC-HC16 SAMSUNG(三星半导体) FBGA-180
K4FBE3D4HM-MGCJ SAMSUNG(三星半导体) BGA-200
K4A8G165WB-BIWE SAMSUNG(三星半导体) FBGA-96
K4A4G165WF-BITD SAMSUNG(三星半导体) FBGA-96
K4F6E3S4HM-THCL SAMSUNG(三星半导体) FBGA-200
H5AN8G6NDJR-XNC HYNIX(海力士) -