Imported IC Domestic IC Burning processing
     
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BR24T1MF-3AME2 ROHM(罗姆) 8-SOP
S29AL008J55TFIR20 Infineon(英飞凌) 48-TSOP
IS62WV6416BLL-55TLI ISSI(美国芯成) 44-TSOP II
CY15B004Q-SXE Infineon(英飞凌) 8-SOIC
BR24T1MFJ-3AME2 ROHM(罗姆) 8-SOP-J
MB85RC64APNF-G-JNE1 Kaga FEI America, Inc. 8-SOP
SST39VF1601C-70-4C-B3KE MICROCHIP(美国微芯) 48-TFBGA(6x8)
23LCV512-I/ST MICROCHIP(美国微芯) 8-TSSOP
SST39VF020-70-4C-NHE MICROCHIP(美国微芯) 32-PLCC(11.43x13.97)
24AA512-I/MF MICROCHIP(美国微芯) 8-DFN-S(6x5)
IS25WP064A-JLLE ISSI(美国芯成) 8-WSON(8x6)
BR24G1MFJ-3AGTE2 ROHM(罗姆) 8-SOP-J
24FC512-I/ST14 MICROCHIP(美国微芯) 14-TSSOP
SST26VF016-80-5I-S2AE MICROCHIP(美国微芯) 8-SOIC
SST39VF800A-70-4I-B3KE MICROCHIP(美国微芯) 48-TFBGA
SST39VF400A-70-4I-B3KE MICROCHIP(美国微芯) 48-TFBGA
24LC512-E/P MICROCHIP(美国微芯) 8-PDIP
SST39VF200A-70-4C-EKE MICROCHIP(美国微芯) 48-TSOP
IS25WP064A-JKLE ISSI(美国芯成) 8-WSON(6x5)
24AA512-I/P MICROCHIP(美国微芯) 8-PDIP