Imported IC Domestic IC Burning processing
     
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BR25H256F-2ACE2 ROHM(罗姆) 8-SOP
BR25H640F-2LBH2 ROHM(罗姆) 8-SOP
GT28F320B3BA100 Intel 48-μBGA CSP
BR24A08F-WLBH2 ROHM(罗姆) 8-SOP
SST39VF802C-70-4I-MAQE MICROCHIP(美国微芯) 48-WFBGA(6x4)
SST39VF801C-70-4I-MAQE MICROCHIP(美国微芯) 48-WFBGA(6x4)
SST39VF802C-70-4C-MAQE MICROCHIP(美国微芯) 48-WFBGA(6x4)
SST39VF801C-70-4C-MAQE MICROCHIP(美国微芯) 48-WFBGA(6x4)
M95512-DRDW3TP/K ST(意法半导体) 8-TSSOP
BR25H128F-2LBH2 ROHM(罗姆) 8-SOP
GT28F160C3TA110 Intel 48-μBGA CSP
W25R64JWZPIQ WINBOND(华邦) 8-WSON(6x5)
GD25LQ128DYIGR GigaDevice Semiconductor (HK) Limited 8-WSON(6x8)
AT25QF128A-MHB-T Adesto Technologies 8-UDFN(5x6)
N25Q064A13ESF40F TT Electronics 16-SOP2
AT25M01-SHM-T MICROCHIP(美国微芯) 8-SOIC
71256SA12YG RENESAS(瑞萨)/IDT 28-SOJ
N25Q032A13EF4A0F TT Electronics 8-UFDFPN(MLP8)(4x3)
EM6GA16LCAEA-12H Etron Technology, Inc. 50-WLCSP(1.96x4.63)
SST39VF200A-70-4C-MAQE MICROCHIP(美国微芯) 48-WFBGA(6x4)