Imported IC Domestic IC Burning processing
     
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K4A4G085WF-BITD SAMSUNG(三星半导体) FBGA-78
K4A4G085WE-BIRC SAMSUNG(三星半导体) FBGA-78
K4F6E3D4HB-MHCJ SAMSUNG(三星半导体) FBGA-200
K4T51083QN SAMSUNG(三星半导体) FBGA-60
K4A8G165WC-BCPB SAMSUNG(三星半导体) FBGA-96
K4A4G165WA-BCTD SAMSUNG(三星半导体) -
M393A8G40MB2-CTD SAMSUNG(三星半导体) -
M393A4G43AB3-CVF SAMSUNG(三星半导体) -
M393A2K43DB3-CWE SAMSUNG(三星半导体) -
M393A2K43DB2-CWE SAMSUNG(三星半导体) -
M393A2K43DB2-CVF SAMSUNG(三星半导体) -
M393A2K40BB1-CRC SAMSUNG(三星半导体) -
M393A1K43DB1-CVF SAMSUNG(三星半导体) -
M393A1G40EB2-CTD SAMSUNG(三星半导体) -
M391A1K43DB2-CTD SAMSUNG(三星半导体) -
M386ABG40M50-CYF SAMSUNG(三星半导体) -
M378A2K43DB1-CTD SAMSUNG(三星半导体) -
K4FBE3D4HM-GFCL SAMSUNG(三星半导体) FBGA-200
K4F8E3S4HD-GUCL SAMSUNG(三星半导体) FBGA-200
K4F4E3S4HF-GUCJ SAMSUNG(三星半导体) FBGA-200