Imported IC Domestic IC Burning processing
     
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KLMBG4GESD-B04P SAMSUNG(三星半导体) -
KLMAG2GESD-B03Q SAMSUNG(三星半导体) -
KLM8G1GEUF-B04Q SAMSUNG(三星半导体) -
KLM8G1GESD-B04P SAMSUNG(三星半导体) -
KMGX6001BA-B514 SAMSUNG(三星半导体) SMD
THGBMFG7C1LBAIL KIOXIA(铠侠) BGA-153
MKEMF008GT1E-I MK(米客方德) FBGA-153(11.5x13)
KLMDG8JEUD-B04P SAMSUNG(三星半导体) -
KLMCG8GESD-B04Q SAMSUNG(三星半导体) -
KLMCG2UCTA-B041 SAMSUNG(三星半导体) -
KLMCG2KCTA-B041 SAMSUNG(三星半导体) -
KLMBG4GEUF-B04Q SAMSUNG(三星半导体) -
KLM8G1GESD-B04Q SAMSUNG(三星半导体) -
HYE4GUECCE HeYangTek(南京扬贺扬) FBGA-153
MKEMF064GT1E-C MK(米客方德) FBGA-153(11.5x13)
H26M41208HPRA HYNIX(海力士) FBGA-153
MKEMF016GT1E-IE MK(米客方德) FBGA-153(11.5x13)
ZDEMDCM016G-84A8 Zetta(澜智) FBGA-153
HYE8GUECCE HeYangTek(南京扬贺扬) FBGA-153
KLMCG4JEUD-B04Q SAMSUNG(三星半导体) -