Imported IC Domestic IC Burning processing
     
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MKEMA064GD1E-C MK(米客方德) FBGA-153
MKEV008GCB-SS510 MK(米客方德) FBGA-153
MKEMF032GZ1E-C MK(米客方德) FBGA-153
MKEV032GCB-SS510 MK(米客方德) FBGA-153
MKEV016GIB-OY500 MK(米客方德) FBGA-153
THGBMFG6C1LBAIL KIOXIA(铠侠) BGA-153
MKEMA032GD1E-C MK(米客方德) FBGA-153
SGM8000C-S27B8G Yeestor(得一微) FBGA-153
SGM8000C-S03BCG Yeestor(得一微) FBGA-153
SGM8005I-S21B8G Yeestor(得一微) FBGA-153
THGAMST0T24BAIL KIOXIA(铠侠) P-WFBGA-153
KMFE60012B-B214 SAMSUNG(三星半导体) SMD
KMFN60012B-B214 SAMSUNG(三星半导体) SMD
THGBMDG5D1LBAIL KIOXIA(铠侠) BGA-153
SDSDQAF3-032G-I SANDISK(闪迪) 15x11x1.0mm
KMDP6001DA-B425 SAMSUNG(三星半导体) FBGA-254
KLMEG8UCTA-B041 SAMSUNG(三星半导体) -
KLMBG4GESD-B04Q SAMSUNG(三星半导体) -
KLMAG2GEUF-B04Q SAMSUNG(三星半导体) -
KLMAG2GESD-B04Q SAMSUNG(三星半导体) -