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Service items
01.
Chip testing
02.
Precision Ball Placement
03.
Firmware Programming
04.
Lead Trimming
05.
Automated Tape Packaging
06.
Chip packaging
07.
Chip Compatibility
Application
01.
AI Data Center
02.
Consumer electronics
03.
Industry and IOT
Advantage
01.
Service Advantages
02.
Product advantages
03.
Solution advantages
News
01.
Enterprise News
02.
Service focus
03.
Industry Insights
About BenteIC
01.
About us
02.
Team Introduction
03.
History
04.
Culture
05.
Honors
06.
Future Plan
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中文
Chip Compatibility
onsemi(安森美)
MICROCHIP(美国微芯)
WINBOND(华邦)
ROHM(罗姆)
ISSI(美国芯成)
ADI(亚德诺)/MAXIM(美信)
RENESAS(瑞萨)/IDT
ABLIC(艾普凌科)
SAMSUNG(三星半导体)
ADI(亚德诺)
HYNIX(海力士)
GigaDevice(兆易创新)
FORESEE(江波龙)
FM(复旦微)
HGSEMI(华冠)
BOYAMICRO(博雅)
PUYA(普冉)
XTX(芯天下)
ICMAX(宏旺)
KIOXIA(铠侠)
CXMT(长鑫)
