• DRAM series

◦ DDR4:17nm process, speed 3200MT/s, timing CL36, model CXMT DDR4 8Gb, used for consumer electronics and industrial control.

◦ LPDDR5: Speed 6400Mbps, power consumption reduced by 30%, model CXMT LPDDR5 8Gb, compatible with smartphones and in-vehicle systems.

◦ HBM2: Sample stage, adopting TSV packaging, planned for mass production in 2026, filling the domestic gap in high-end storage.