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Build a one-stop IC adaptation solution
Build a one-stop IC adaptation solution
聚焦“IC全球渠道+中国代理+烧录测试”配套服务
  • 2000+

    Chip model

  • 99.9%

    The yield rate of chip burning processing is as high as

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    Winbond
    Winbond

    • NOR Flash series

    W25Q series: SPI interface, speed 533MHz, capacity 1-256Mb, supports dual/quad-channel. Models like W25Q128JVSSIQ are used for smart home and Internet of Things devices.

    W25Q RV series: Small Size Package (WLCSP), supports SiP integration, suitable for wearable devices and space-constrained scenarios.

    • DRAM series

    W97 series: DDR2 SDRAM, speed 400MHz, capacity 256Mb-1Gb, models like W9725G6IB, used for set-top boxes and printers.