Great news! 29th May，The chip back-end precision processing project of BenteIC Precision (Shenzhen) in Longhua has been officially put into operation. We focus on core businesses including BGA ball placement, IC testing, IC programming, finished product inspection, chip kitting and post-packaging processing, and provide one-stop comprehensive solutions for chip back-end manufacturing to supplement the production capacity of precision semiconductor processing in the region.


Equipped with high-precision production equipment and mature technologies, our project supports mass production of 0.25mm ultra-fine pitch BGA chips, overcoming technical challenges of ultra-fine pitch ball placement. Our services are widely applied in consumer electronics, automotive semiconductors, memory chips, industrial control chips and other fields, catering to the manufacturing demands of mid-to-high-end chips.


Currently, our daily production capacity reaches 50,000 pieces. The complete production process covers ball placement, electrical testing, function programming, full inspection, sorting and final delivery. We adopt standardized quality control and traceable management throughout production to ensure high efficiency and qualified yield. With a professional technical team, dust-free workshop and reliable delivery system, we provide stable, efficient and cost-effective OEM services for chip design enterprises, electronic manufacturers and supply chain providers.


Dedicating to the chip back-end precision processing industry, BenteIC keeps optimizing core technologies and expanding production layout. The launch of the Longhua project further strengthens our service capability in the South China semiconductor industrial chain and boosts the high-quality development of domestic chip industry. We adhere to strict quality standards and flexible delivery, and look forward to cooperating with all partners for joint progress in the semiconductor sector.