BenteIC exclusively owns this invention patent. As a core technological breakthrough in the chip packaging field, this BGA ball mounting carrying fixture and ball implantation device with adaptive chip warpage precisely targets the core industry pain points, including high-temperature chip warpage, insufficient ball mounting precision, and frequent missing balls and cold solder joints, bringing subversive process upgrades to high-end chip packaging production.


This patented technology innovatively adopts a flexible support combined with independent partitioned adsorption design, which can dynamically adapt to the warpage deformation of chips during high-temperature processing. Through precise deformation compensation, it maintains the flatness of the chip throughout the process, and completely eliminates problems such as chip damage and solder ball offset caused by traditional rigid fixtures. At the same time, it is equipped with a high-precision online visual inspection system, which realizes full-dimensional real-time scanning immediately after the ball mounting process, quickly and accurately screens various defects such as missing balls, cold solder joints and solder ball offset, achieving full-process closed-loop quality control without any quality loopholes.


Relying on this patented technology of BenteIC, it can comprehensively improve the position accuracy, coplanarity and product consistency of BGA ball mounting, fundamentally solve various ball mounting defects caused by warpage in the chip packaging process, and perfectly meet the stringent packaging requirements of high-end precision chips such as 5G communication, AI computing, automotive-grade and industrial control. Its advantages are more prominent especially for ultra-fine pitch, large-size and thin chip packaging scenarios.
Choosing BenteIC's patented BGA ball mounting technology can effectively greatly improve product yield for customers, significantly reduce product rework and scrap costs, simplify production processes, shorten processing time, comprehensively improve chip packaging production efficiency, help customers reduce production costs and enhance core product competitiveness. It enables large-scale chip packaging production with high quality, high efficiency and high reliability, and builds a solid technological foundation for customers' competition in the semiconductor industry.