BenteIC specializes in back-end precision finishing of integrated circuits. Centered on the five core processes of IC Testing, BGA Rework & Reballing, Program Burning, Lead Forming, and Automatic Taping, we have built a full-process proprietary R&D technology system and a patent portfolio, forming a rare full-process in-house R&D technology closed loop in the industry. We are committed to providing stable and reliable back-end finishing support for chip manufacturers and brand distributors.


Rather than simple contract manufacturing, we deliver quantifiable advantages in precision, production yield, process stability and delivery consistency through independently developed processes, dedicated equipment, testing algorithms and production control systems, safeguarding product quality for our partners.

Core Technology for IC Testing
Adopting high-precision probe auto-alignment + high/low temperature compensation technology:
• Probe alignment accuracy up to ±1.5μm. With visual positioning and real-time pressure feedback correction, it effectively resolves poor contact, false testing and missing testing of micro-pitch chips 0.3mm and below.
• Equipped with automatic resistance correction algorithm under high and low temperature environments, the testing error is controlled within ≤0.5% in a wide temperature range of -40℃~125℃, greatly improving testing accuracy under complex working conditions.
• Realizes full screening of electrical and functional defects at source, with process defect escape rate controlled at ≤50 DPM, ensuring zero hidden dangers in delivered chips and more stable and reliable quality for end products.