By adopting high-precision alignment and constant-temperature molding technology, the ball placement accuracy is ±0.01mm. The solder joints are full and free of voids or misalignment. The one-time molding yield rate is ≥99%. It is compatible with various packaging types such as BGA/QFN, meeting the processing requirements for high-end chips.

Using multi-channel fully automatic programming, the daily production capacity of a single device can reach 80,000 chips. It supports program encryption and dual verification, has a programming accuracy rate of 100%, is fast and stable, and is suitable for large-scale mass production requirements.

Standardized correction, shaping and stress relief are carried out on the chip pins. The flatness error of the pins is ≤ 0.02mm. The appearance is uniform and the welding is highly compatible, significantly improving the yield rate of the subsequent SMT assembly process.

Fully automatic tape loading and packaging, visual inspection, precise tray placement. The defective rate of tape packaging is less than 0.1%. The packaging is uniform and standardized, allowing for direct machine assembly and soldering. The logistics protection is stronger, significantly improving the customer's production efficiency.