BenteIC - Specializing in Back-End Finishing & Supporting Services

BenteIC

One-stop service for IC post-processing fine processing

Adhere to the core values of "Precision, Trustworthiness, Innovation, Collaboration"

Build a "IC" packaging - testing - burning - ball mounting - whole pad - tape and reel + chip adaptation" full-chain service

Core service

A full-service provider covering the entire chip production chain from "packaging - testing - programming - ball bonding - final mounting - tape packaging + chip adaptation"

01

Chip testing

02

Precision Ball Placement

Automated Tape Packaging

06

Chip Compatibility

Application

BenteIC, through its own independent research and development

has established six core technological barriers for precision processing.

About BenteIC

Provide a chip back-end finishing solution with controllable quality and efficient delivery.

Advanced equipment

8₊

Automatic Burn-in Test | BGA Placement Equipment

Human resource advantage

12₊

A seasoned technical team of people

Customer Advantage

100₊

Premium customers

Research and development advantages

10₊

Invention and utility model technologies

Latest News

Service focus

2026-04-01

BenteIC Core Technical Barriers

Enterprise News

2026-03-25

BenteIC: One-Stop IC Full-Process Service Expert Empowering Efficient Development of the Chip Indust

2026-03-20

BenteIC: Beyond Chip Matching, We Offer One-Stop IC Backend Precision Processing Services!

2026-03-09

Samsung’s Market Share Hits New High! Reasons Behind Flat Global TV Shipments in Q4 2025 Revealed

2026-03-02

Storage Chip Storm Hits! China’s Breakthrough Reshapes Global Landscape, A-Shares Industry Chain See